The world’s largest selection of electronic components in stock for immediate shipment!
To consistently meet or exceed customer expectations.
E-XFL.COM is an authorized distributor of electronics components for more than 400 industry-leading suppliers.
LOGO E-XFL
Language RFQ

PROHMSILVERFLOW-1.5

ProhmTect
PROHMSILVERFLOW-1.5 Preview
PROHMSILVERFLOW-1.5
ProhmTect
ELEC THERM COND PASTE NONSILIC 1
Reference Price (USD)
1+
$23.99000
500+
$23.7501
1000+
$23.5102
1500+
$23.2703
2000+
$23.0304
2500+
$22.7905
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
PROHMSILVERFLOW-1.5

PROHMSILVERFLOW-1.5

$ 23.99

Product details

Product Attributes

  • product status: Active
  • type: Non-Silicone Paste
  • size / dimension: 1.5cc Syringe
  • usable temperature range: -30°F ~ 550°F (-34°C ~ 288°C)
  • color: Silver
  • thermal conductivity: -
  • features: -
  • shelf life: 24 Months
  • storage/refrigeration temperature: Room Temperature

You May Also Be Interested In

PK700DM-140
Shiu Li Technology Co., Ltd.

PK700DM-140

TWO-PART THERMAL LIQUID GAP FILL
N-PUTTY2-100
Shiu Li Technology Co., Ltd.

N-PUTTY2-100

NON-SILICONE THERMAL PUTTY 100G,
TC-GC-03-A
Gelid Solutions LLC

TC-GC-03-A

THERMAL COMPOUND 3.5GR, 8.5W
PROHMLUBE-1000-5.0
ProhmTect

PROHMLUBE-1000-5.0

NON-COND CONTACT LUBE 5.0ML SYRI
TC1-200G
Chip Quik Inc.

TC1-200G

HEAT SINK COMPOUND - HIGH DENSIT
21-390-001-055M
Jones Tech

21-390-001-055M

THERMAL GEL 55CC BLUE, 9W/M-K
TH235-2-30G-2SYR
Penchem Technologies Sdn Bhd

TH235-2-30G-2SYR

NON SILICONE THERMAL PUTTY
BT-301-200M
Wakefield-Vette

BT-301-200M

FAST CURING THERMALLY CONDUCTIVE
PK700DM-140-KIT
Shiu Li Technology Co., Ltd.

PK700DM-140-KIT

TWO-PART THERMAL LIQUID GAP FILL
TC3-10G
Chip Quik Inc.

TC3-10G

HEAT SINK THERMAL COMPOUND

Expert Quality Assessments

Year-Round Warranty Coverage

Worldwide Sourcing

Round-the-Clock Customer Support

Top