TH997-288-192-5.0
Penchem Technologies Sdn Bhd
TH997-288-192-5.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
Reference Price (USD)
Exquisite packaging
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TH997-288-192-5.0
$ 34.65
Product details
Product Attributes
- product status: Active
- usage: Thermally Conductive
- type: Gap Filler Pad, Sheet
- shape: Rectangular
- outline: 288.00mm x 192.00mm
- thickness: 0.197" (5.00mm)
- material: Silicone
- adhesive: Tacky - Both Sides
- backing, carrier: -
- color: Blue
- thermal resistivity: -
- thermal conductivity: 2.4W/m-K
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