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TH997-288-192-2.0

Penchem Technologies Sdn Bhd
TH997-288-192-2.0 Preview
TH997-288-192-2.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
Reference Price (USD)
1+
$19.05000
500+
$18.8595
1000+
$18.669
1500+
$18.4785
2000+
$18.288
2500+
$18.0975
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
TH997-288-192-2.0

TH997-288-192-2.0

$ 19.05

Product details

Product Attributes

  • product status: Active
  • usage: Thermally Conductive
  • type: Gap Filler Pad, Sheet
  • shape: Rectangular
  • outline: 288.00mm x 192.00mm
  • thickness: 0.0790" (2.000mm)
  • material: Silicone
  • adhesive: Tacky - Both Sides
  • backing, carrier: -
  • color: Blue
  • thermal resistivity: -
  • thermal conductivity: 2.4W/m-K

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