TH994-288-192-3.0
Penchem Technologies Sdn Bhd
TH994-288-192-3.0
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
Reference Price (USD)
Exquisite packaging
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TH994-288-192-3.0
$ 120.00
Product details
Product Attributes
- product status: Active
- usage: Thermally Conductive
- type: Gap Filler Pad, Sheet
- shape: Rectangular
- outline: 288.00mm x 192.00mm
- thickness: 0.118" (3.00mm)
- material: Silicone
- adhesive: Tacky - Both Sides
- backing, carrier: -
- color: Gray
- thermal resistivity: -
- thermal conductivity: 8.0W/m-K
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