BU200Z-178-HT
On Shore Technology Inc.
BU200Z-178-HT
On Shore Technology Inc.
CONN IC DIP SOCKET 20POS GOLD
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BU200Z-178-HT
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Product details
Product Attributes
- product status: Obsolete
- type: DIP, 0.3" (7.62mm) Row Spacing
- number of positions or pins (grid): 20 (2 x 10)
- pitch - mating: 0.100" (2.54mm)
- contact finish - mating: Gold
- contact finish thickness - mating: 78.7µin (2.00µm)
- contact material - mating: Beryllium Copper
- mounting type: Surface Mount
- features: Open Frame
- termination: Solder
- pitch - post: 0.100" (2.54mm)
- contact finish - post: Copper
- contact finish thickness - post: Flash
- contact material - post: Brass
- housing material: Polybutylene Terephthalate (PBT), Glass Filled
- operating temperature: -55°C ~ 125°C
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