XR2A-1801-N
Omron Electronics Inc-EMC Div
XR2A-1801-N
Omron Electronics Inc-EMC Div
CONN IC DIP SOCKET 18POS GOLD
Reference Price (USD)
1+
$3.10000
500+
$3.069
1000+
$3.038
1500+
$3.007
2000+
$2.976
2500+
$2.945
Exquisite packaging
Discount
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Product details
Product Attributes
- product status: Active
- type: DIP, 0.3" (7.62mm) Row Spacing
- number of positions or pins (grid): 18 (2 x 9)
- pitch - mating: 0.100" (2.54mm)
- contact finish - mating: Gold
- contact finish thickness - mating: 30.0µin (0.76µm)
- contact material - mating: Beryllium Copper
- mounting type: Through Hole
- features: Open Frame
- termination: Solder
- pitch - post: 0.100" (2.54mm)
- contact finish - post: Gold
- contact finish thickness - post: 30.0µin (0.76µm)
- contact material - post: Beryllium Copper
- housing material: Polybutylene Terephthalate (PBT), Glass Filled
- operating temperature: -55°C ~ 125°C