IW-HSKALU-CLASLR-CU03
iWave Systems
IW-HSKALU-CLASLR-CU03
iWave Systems
ZU+ MPSOC SOM MODULE HEATSINK
Reference Price (USD)
Exquisite packaging
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IW-HSKALU-CLASLR-CU03
$ 43.20
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: FPGA
- attachment method: Bolt On
- shape: Rectangular, Fins
- length: 3.740" (95.00mm)
- width: 2.953" (75.00mm)
- diameter: -
- fin height: 1.181" (30.00mm)
- power dissipation @ temperature rise: -
- thermal resistance @ forced air flow: -
- thermal resistance @ natural: -
- material: Aluminum
- material finish: -
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