HSS08-B18-CP
CUI Devices
HSS08-B18-CP
CUI Devices
HEAT SINK, STAMPING, TO-218, 44.
Reference Price (USD)
1+
$2.00000
500+
$1.98
1000+
$1.96
1500+
$1.94
2000+
$1.92
2500+
$1.9
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSS08-B18-CP
$ 2.00
Product details
Product Attributes
- product status: Active
- type: Board Level, Vertical
- package cooled: TO-218
- attachment method: PC Pin
- shape: Square
- length: 1.750" (44.45mm)
- width: 1.750" (44.45mm)
- diameter: -
- fin height: 0.492" (12.50mm)
- power dissipation @ temperature rise: 10.3W @ 75°C
- thermal resistance @ forced air flow: 3.50°C/W @ 200 LFM
- thermal resistance @ natural: 7.29°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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