HSS-C2591-SMT-TR
CUI Devices
HSS-C2591-SMT-TR
CUI Devices
HEAT SINK TO-263 COPPER
Reference Price (USD)
1+
$0.65044
500+
$0.6439356
1000+
$0.6374312
1500+
$0.6309268
2000+
$0.6244224
2500+
$0.617918
Exquisite packaging
Discount
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Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: TO-263 (D²Pak)
- attachment method: -
- shape: Rectangular, Fins
- length: 0.591" (15.00mm)
- width: 1.020" (25.91mm)
- diameter: -
- fin height: 0.375" (9.52mm)
- power dissipation @ temperature rise: 2.1W @ 75°C
- thermal resistance @ forced air flow: 8.15°C/W @ 200 LFM
- thermal resistance @ natural: 35.71°C/W
- material: Copper
- material finish: Tin