HSE07-753045
CUI Devices
HSE07-753045
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
Reference Price (USD)
1+
$3.40000
500+
$3.366
1000+
$3.332
1500+
$3.298
2000+
$3.264
2500+
$3.23
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSE07-753045
$ 3.40
Product details
Product Attributes
- product status: Active
- type: Board Level
- package cooled: TO-218, TO-220
- attachment method: Clip
- shape: Rectangular, Fins
- length: 2.953" (75.00mm)
- width: 1.181" (30.00mm)
- diameter: -
- fin height: 1.772" (45.00mm)
- power dissipation @ temperature rise: 15.46W @ 75°C
- thermal resistance @ forced air flow: 2.10°C/W @ 200 LFM
- thermal resistance @ natural: 4.85°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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