HSE-B18635-060H-W
CUI Devices
HSE-B18635-060H-W
CUI Devices
HEAT SINK, EXTRUSION, TO-218, 63
Reference Price (USD)
1+
$1.48632
500+
$1.4714568
1000+
$1.4565936
1500+
$1.4417304
2000+
$1.4268672
2500+
$1.412004
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Product Attributes
- product status: Active
- type: Board Level, Vertical
- package cooled: TO-218
- attachment method: Bolt On and PC Pin
- shape: Rectangular, Angled Fins
- length: 2.500" (63.50mm)
- width: 1.638" (41.60mm)
- diameter: -
- fin height: 0.984" (25.00mm)
- power dissipation @ temperature rise: 16.7W @ 75°C
- thermal resistance @ forced air flow: 2.24°C/W @ 200 LFM
- thermal resistance @ natural: 4.49°C/W
- material: Aluminum Alloy
- material finish: Black Anodized