HSB27-434316
CUI Devices
HSB27-434316
CUI Devices
HEAT SINK, BGA, 43.1 X 43.1 X 16
Reference Price (USD)
1+
$2.60000
500+
$2.574
1000+
$2.548
1500+
$2.522
2000+
$2.496
2500+
$2.47
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB27-434316
$ 2.60
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: BGA
- attachment method: Adhesive
- shape: Square, Pin Fins
- length: 1.697" (43.10mm)
- width: 1.697" (43.10mm)
- diameter: -
- fin height: 0.650" (16.51mm)
- power dissipation @ temperature rise: 8.98W @ 75°C
- thermal resistance @ forced air flow: 2.80°C/W @ 200 LFM
- thermal resistance @ natural: 8.35°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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