HSB26-343408
CUI Devices
HSB26-343408
CUI Devices
HEAT SINK, BGA, 33.5 X 33.5 X 8
Reference Price (USD)
1+
$1.14000
500+
$1.1286
1000+
$1.1172
1500+
$1.1058
2000+
$1.0944
2500+
$1.083
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB26-343408
$ 1.14
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: BGA
- attachment method: Adhesive
- shape: Square, Pin Fins
- length: 1.319" (33.50mm)
- width: 1.319" (33.50mm)
- diameter: -
- fin height: 0.315" (8.00mm)
- power dissipation @ temperature rise: 4.94W @ 75°C
- thermal resistance @ forced air flow: 5.30°C/W @ 200 LFM
- thermal resistance @ natural: 15.19°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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