HSB09-212115
CUI Devices
HSB09-212115
CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
Reference Price (USD)
1+
$0.93000
500+
$0.9207
1000+
$0.9114
1500+
$0.9021
2000+
$0.8928
2500+
$0.8835
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB09-212115
$ 0.93
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: BGA
- attachment method: Adhesive
- shape: Square, Pin Fins
- length: 0.827" (21.00mm)
- width: 0.827" (21.00mm)
- diameter: -
- fin height: 0.591" (15.00mm)
- power dissipation @ temperature rise: 4.3W @ 75°C
- thermal resistance @ forced air flow: 6.00°C/W @ 200 LFM
- thermal resistance @ natural: 17.39°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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