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HSB07-202009

CUI Devices
HSB07-202009 Preview
HSB07-202009
CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
Reference Price (USD)
1+
$0.58140
500+
$0.575586
1000+
$0.569772
1500+
$0.563958
2000+
$0.558144
2500+
$0.55233
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB07-202009

HSB07-202009

$ 0.58

Product details

Product Attributes

  • product status: Active
  • type: Top Mount
  • package cooled: BGA
  • attachment method: Adhesive
  • shape: Square, Pin Fins
  • length: 0.787" (20.00mm)
  • width: 0.787" (20.00mm)
  • diameter: -
  • fin height: 0.354" (9.00mm)
  • power dissipation @ temperature rise: 3.1W @ 75°C
  • thermal resistance @ forced air flow: 8.60°C/W @ 200 LFM
  • thermal resistance @ natural: 24.08°C/W
  • material: Aluminum Alloy
  • material finish: Black Anodized

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