HSB07-202009
CUI Devices
HSB07-202009
CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
Reference Price (USD)
1+
$0.58140
500+
$0.575586
1000+
$0.569772
1500+
$0.563958
2000+
$0.558144
2500+
$0.55233
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB07-202009
$ 0.58
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: BGA
- attachment method: Adhesive
- shape: Square, Pin Fins
- length: 0.787" (20.00mm)
- width: 0.787" (20.00mm)
- diameter: -
- fin height: 0.354" (9.00mm)
- power dissipation @ temperature rise: 3.1W @ 75°C
- thermal resistance @ forced air flow: 8.60°C/W @ 200 LFM
- thermal resistance @ natural: 24.08°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
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