HSB01-080808
CUI Devices
HSB01-080808
CUI Devices
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Reference Price (USD)
1+
$0.50672
500+
$0.5016528
1000+
$0.4965856
1500+
$0.4915184
2000+
$0.4864512
2500+
$0.481384
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
HSB01-080808
$ 0.51
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: BGA
- attachment method: Adhesive
- shape: Square, Pin Fins
- length: 0.335" (8.50mm)
- width: 0.335" (8.50mm)
- diameter: -
- fin height: 0.315" (8.00mm)
- power dissipation @ temperature rise: 1.9W @ 75°C
- thermal resistance @ forced air flow: 16.00°C/W @ 200 LFM
- thermal resistance @ natural: 39.10°C/W
- material: Aluminum Alloy
- material finish: Black Anodized
You May Also Be Interested In
