BDN18-3CB/A01
CTS Thermal Management Products
BDN18-3CB/A01
CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.81"SQ
Reference Price (USD)
1+
$5.19000
500+
$5.1381
1000+
$5.0862
1500+
$5.0343
2000+
$4.9824
2500+
$4.9305
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
BDN18-3CB/A01
$ 5.19
Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: Assorted (BGA, LGA, CPU, ASIC...)
- attachment method: Thermal Tape, Adhesive (Included)
- shape: Square, Pin Fins
- length: 1.810" (45.97mm)
- width: 1.810" (45.97mm)
- diameter: -
- fin height: 0.355" (9.02mm)
- power dissipation @ temperature rise: -
- thermal resistance @ forced air flow: 3.50°C/W @ 400 LFM
- thermal resistance @ natural: 10.80°C/W
- material: Aluminum
- material finish: Black Anodized
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