APF19-19-13CB/A01
CTS Thermal Management Products
APF19-19-13CB/A01
CTS Thermal Management Products
HEATSINK FORGED W/ADHESIVE TAPE
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Exquisite packaging
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Product details
Product Attributes
- product status: Active
- type: Top Mount
- package cooled: Assorted (BGA, LGA, CPU, ASIC...)
- attachment method: Thermal Tape, Adhesive (Included)
- shape: Square, Fins
- length: 0.748" (19.00mm)
- width: 0.748" (19.00mm)
- diameter: -
- fin height: 0.500" (12.70mm)
- power dissipation @ temperature rise: -
- thermal resistance @ forced air flow: 4.00°C/W @ 200 LFM
- thermal resistance @ natural: -
- material: Aluminum
- material finish: Black Anodized