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C8120-04

Aries Electronics
C8120-04 Preview
C8120-04
Aries Electronics
CONN IC DIP SOCKET 20POS TIN
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C8120-04

C8120-04

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Product details

Product Attributes

  • product status: Obsolete
  • type: DIP, 0.3" (7.62mm) Row Spacing
  • number of positions or pins (grid): 20 (2 x 10)
  • pitch - mating: 0.100" (2.54mm)
  • contact finish - mating: Tin
  • contact finish thickness - mating: 200.0µin (5.08µm)
  • contact material - mating: Phosphor Bronze
  • mounting type: Through Hole
  • features: Closed Frame
  • termination: Wire Wrap
  • pitch - post: 0.100" (2.54mm)
  • contact finish - post: Tin
  • contact finish thickness - post: 200.0µin (5.08µm)
  • contact material - post: Phosphor Bronze
  • housing material: Polyamide (PA46), Nylon 4/6, Glass Filled
  • operating temperature: -55°C ~ 105°C

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