24-516-10
Aries Electronics
24-516-10
Aries Electronics
CONN IC DIP SOCKET ZIF 24POS TIN
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Product details
Product Attributes
- product status: Obsolete
- type: DIP, ZIF (ZIP)
- number of positions or pins (grid): 24 (2 x 12)
- pitch - mating: 0.100" (2.54mm)
- contact finish - mating: Tin
- contact finish thickness - mating: 10.0µin (0.25µm)
- contact material - mating: Beryllium Copper
- mounting type: Through Hole
- features: Closed Frame
- termination: Solder
- pitch - post: 0.100" (2.54mm)
- contact finish - post: Tin
- contact finish thickness - post: 10.0µin (0.25µm)
- contact material - post: Beryllium Copper
- housing material: Polyamide (PA46), Nylon 4/6, Glass Filled
- operating temperature: -
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