DILB18P-223TLF
Amphenol ICC (FCI)
DILB18P-223TLF
Amphenol ICC (FCI)
CONN IC DIP SOCKET 18POS TINLEAD
Reference Price (USD)
1+
$0.71000
500+
$0.7029
1000+
$0.6958
1500+
$0.6887
2000+
$0.6816
2500+
$0.6745
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Product details
Product Attributes
- product status: Active
- type: DIP, 0.3" (7.62mm) Row Spacing
- number of positions or pins (grid): 18 (2 x 9)
- pitch - mating: 0.100" (2.54mm)
- contact finish - mating: Tin-Lead
- contact finish thickness - mating: 100.0µin (2.54µm)
- contact material - mating: Copper Alloy
- mounting type: Through Hole
- features: Open Frame
- termination: Solder
- pitch - post: 0.100" (2.54mm)
- contact finish - post: Tin-Lead
- contact finish thickness - post: 100.0µin (2.54µm)
- contact material - post: Copper Alloy
- housing material: Polyamide (PA), Nylon
- operating temperature: -55°C ~ 125°C