374324B00035G
Aavid, Thermal Division of Boyd Corporation
374324B00035G
Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/ADHESIVE TAPE
Reference Price (USD)
1+
$2.54000
500+
$2.5146
1000+
$2.4892
1500+
$2.4638
2000+
$2.4384
2500+
$2.413
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
374324B00035G
$ 2.54
Product details
Product Attributes
- product status: Active
- type: Board Level
- package cooled: BGA, FPGA
- attachment method: Thermal Tape, Adhesive (Included)
- shape: Square, Pin Fins
- length: 1.063" (27.00mm)
- width: 1.063" (27.00mm)
- diameter: -
- fin height: 0.394" (10.00mm)
- power dissipation @ temperature rise: 3.0W @ 90°C
- thermal resistance @ forced air flow: 9.30°C/W @ 200 LFM
- thermal resistance @ natural: 30.60°C/W
- material: Aluminum
- material finish: Black Anodized
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