Imec integrates InP chiplet on 300mm RF silicon interposer, yielding 0.1dB insertion loss at 140GHz 2024-11-28 At the 70th annual IEEE International Electron Devices Meeting (IEDM 2024) in San Francisco, CA, USA (7–11 December), nanoelectronics research center imec of Leuven
The Rise of Chiplets: A New Era in Semiconductor Innovation 2024-11-29 The idea of chiplets is simple: develop the best semiconductors for the needed functions using the most proper manufacturing process.
Intel Foundry Unveils Technology Advancements at IEDM 2024 2024-11-30 Intel Foundry unveiled new breakthroughs to help drive the semiconductor industry forward into the next decade and beyond.
Renesas Introduces Industry’s First One-Chip 9-Axis Motion Control MPU 2024-12-04 The new RZ/T2H chip combines multiple cores, real-time control, Ethernet, and advanced security into a one-chip microprocessor.